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Comparison of the weight loss and adherence of nine different polyimide films thermally aged at 315 C and 350 C in airThermal exposure experiments at 315 and 350 C were performed in air on nine different types of polyimides applied to thin 304 stainless steel foils. The tests were conducted to determine which polyimide was the most thermally stable and adherent when subjected to long exposure times at elevated temperatures. One polyimide designated PIC-7 was found to be more thermally stable than the others; however, it did not possess the adherent properties of PIC-2 and PIC-5. It was concluded that as far as thermal stability and adherence are concerned, five of the polyimides are more suitable for high temperature applications than the other four.
Document ID
19800009916
Acquisition Source
Legacy CDMS
Document Type
Technical Memorandum (TM)
Authors
Fusaro, R. L.
(NASA Lewis Research Center Cleveland, OH, United States)
Date Acquired
September 4, 2013
Publication Date
March 1, 1980
Subject Category
Nonmetallic Materials
Report/Patent Number
E-286
NASA-TM-81381
Accession Number
80N18183
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.
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