Development of a Thick-film Silicon Ribbon Growth Technique for Application to Large-area Solar Cells and Arrays

A new technique is described for growth of large-area silicon ribbons. This technique is an edge-defined, film-fed growth process by which single crystals can be grown having a shape controlled by the outside dimensions of a shaping die, growth taking place from an extremely thin film of liquid fed by capillary action from a crucible below. The material from which the die is fabricated is very critical to the process. The die must be wet by the silicon, but adverse impurities must not be introduced into the silicon, and the die must not become degraded by the molten silicon. A breakthrough in die fabrication that has allowed the growth of silicon ribbons having dimensions of 1 cm by 30 cm with a thickness of 0.7 mm is described. The implications of this significant advancement with respect to development of photovoltaic solar arrays for wide-scale terrestrial solar-to-electric energy conversion systems are discussed.