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Comparison of DOD tape automated bonding programsTape automated bonding (TAB) shows promise of being the predominant assembly and interconnect technique for microcircuit devices in the 1980's. After briefly reviewing the evolution of TAB, consideration was given to factors influencing and motivating TAB, including current major problem areas. Solutions to these problems are being investigated under five Department of Defense programs. These complementary efforts are discussed and compared. The findings are contrasted against recent improvements and advancements in automated wire bonding.
Document ID
19780008327
Acquisition Source
Legacy CDMS
Document Type
Conference Paper
Authors
Unger, R. F. (Naval Ocean Systems Center San Diego, CA, United States)
Date Acquired
August 9, 2013
Publication Date
November 1, 1977
Publication Information
Publication: NASA. Marshall Space Flight Center Proc. of the 1977 NASA(ISHM Microelectronics Conf.
Subject Category
Electronics And Electrical Engineering
Accession Number
78N16270
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.

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IDRelationTitle19780008323Collected WorksProceedings of the 1977 NASA/ISHM Microelectronics Conference
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