The role of hybrid construction techniques on sealed moisture levels

Residual gas analysis techniques were employed to measure the moisture in sealed hybrid packages as a function of substrate attach material, vacuum bake time and sequence, and sealing procedure. It is shown that when room atmospheric exposure is eliminated following the vacuum bakeout moisture levels of less than 1000 ppm may be achieved for modest bake times and solder substrate attach techniques. Suitable moisture levels were achieved for epoxy attached substrates only when seam sealing procedures were employed.