Field experience with various slicing methods

Wafer slicing using internal diameter (ID) saw, multiblade slurry (MBS) saw and multiwire slurry (MWS) saw techniques were evaluated. Wafer parameters such as bow, taper, and roughness which may not be important factors for solar cell fabrication, were considerably better for ID saw than those of the MBS and MWS saw. Analysis of add-on slicing cost indicated that machine productivity seems to be a major limiting factor for ID saw, while expendible material costs are a major factor for both MBS and MWS saw. Slicing experience indicated that the most important factors controling final wafer cost are: (1) silicon cost (wafer thickness + kerf loss); (2) add-on slicing cost, and (3) mechanical yield. There is a very strong interaction between these parameters, suggesting a necessity of optimization of these parameters.