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Silicon ribbon stress-strain activitiesThe finite element method is used to investigate stress/strain in silicon ribbon. Failure considerations such as residual stress, buckling material non-linearity and creep are discussed. Temperature profiles are presented.
Document ID
19850024124
Acquisition Source
Legacy CDMS
Document Type
Conference Paper
Authors
Wada, B. K. (Jet Propulsion Lab., California Inst. of Tech. Pasadena, CA, United States)
Shih, C. F. (Jet Propulsion Lab., California Inst. of Tech. Pasadena, CA, United States)
Kuo, C. P. (Jet Propulsion Lab., California Inst. of Tech. Pasadena, CA, United States)
Phillips, W. M. (Jet Propulsion Lab., California Inst. of Tech. Pasadena, CA, United States)
Date Acquired
August 12, 2013
Publication Date
October 1, 1984
Publication Information
Publication: Proc. of the 24th Project Integration Meeting
Subject Category
Energy Production And Conversion
Accession Number
85N32437
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.

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IDRelationTitle19850024081Collected WorksProceedings of the 24th Project Integration Meeting
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