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Use of Hydration Inhibitors to Improve Bond Durability of Aluminum Adhesive JointsAn investigation is conducted of the mechanisms by which nitrilotris methylene phosphonic acid (NTMP) and related compounds are adsorbed onto oxidized aluminum surfaces to inhibit hydration and increase the durability of adhesive bonds formed with inhibitor-treated panels. P - O - Al bonds are identified as the basis of adsorption, and it is found that water initially adsorbed onto the etched aluminum surfaces is displaced by the NTMP. The hydration of the NTMP-treated surfaces occurs in three stages, namely the reverisble physisorption of water, the slow dissolution of NTMP followed by rapid hydration of the freshly exposed Al2O3 to AlOOH and further hydration of the surface to Al(OH)3. Five properties of an ideal inhibitor are identified.
Document ID
19860001784
Acquisition Source
Legacy CDMS
Document Type
Conference Paper
Authors
Davis, G. D.
(Martin Marietta Corp. Baltimore, MD, United States)
Ahearn, J. S.
(Martin Marietta Corp. Baltimore, MD, United States)
Matienzo, L. J.
(Martin Marietta Corp. Baltimore, MD, United States)
Venables, J. D.
(Martin Marietta Corp. Baltimore, MD, United States)
Date Acquired
August 12, 2013
Publication Date
September 1, 1985
Publication Information
Publication: NASA. Langley Research Center Welding, Bonding and Fastening, 1984
Subject Category
Nonmetallic Materials
Accession Number
86N11251
Funding Number(s)
CONTRACT_GRANT: N00014-80-C-0718
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.
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