Reduction of Moisture Effects During the Cure of Epoxy Adhesives Used in Composite Repair

The requirements for repair work on Naval aircraft composite wing skins that can be performed under depot conditions (or still worse, under field conditions) are quite restrictive. Equipment that can be used is rather limited as are the available repair space and time. The procedures must be simple enough so that they can be performed satisfactorily by personnel without special knowledge in composite materials technology. Repairs of small holes should not require more than perhaps a short predrying cycle (with heat guns) and a subsequent patch bonding using a heating blanket, held in place by applying a vacuum. However, it has been observed during simulated experimental repair work that the glue lines frequently show a high content of pores and bubbles which are attributed to evaporation of moisture during the curing cycle. (Of course, other volatile materials such as residual solvent would act similarly). The purpose of this paper is to give some detailed analysis of the problem of moisture transport as a function of repair conditions, and to discuss some preliminary work to reduce the effect of moisture by removing moisture chemically with carbodiimides before it reaches a critical level for bubble formations.