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Report of the sensor readout electronics panelThe findings of the Sensor Readout Electronics Panel are summarized in regard to technology assessment and recommended development plans. In addition to two specific readout issues, cryogenic readouts and sub-electron noise, the panel considered three advanced technology areas that impact the ability to achieve large format sensor arrays. These are mega-pixel focal plane packaging issues, focal plane to data processing module interfaces, and event driven readout architectures. Development in each of these five areas was judged to have significant impact in enabling the sensor performance desired for the Astrotech 21 mission set. Other readout issues, such as focal plane signal processing or other high volume data acquisition applications important for Eos-type mapping, were determined not to be relevant for astrophysics science goals.
Document ID
19920013376
Acquisition Source
Legacy CDMS
Document Type
Conference Paper
Authors
Fossum, Eric R.
(Jet Propulsion Lab. California Inst. of Tech., Pasadena., United States)
Carson, J.
(Irvine Sensors Corp. Costa Mesa, CA., United States)
Kleinhans, W.
(Valley Oak Semiconductor, Inc., Westlake Village CA., United States)
Kosonocky, W.
(New Jersey Inst. of Tech. Newark., United States)
Kozlowski, L.
(Rockwell International Science Center Anaheim, CA., United States)
Pecsalski, A.
(TRW Space Technology Labs. Redondo Beach, CA., United States)
Silver, A.
(California Univ. Berkeley. Lawrence Berkeley Lab., United States)
Spieler, H.
(Jet Propulsion Lab., California Inst. of Tech. Pasadena, CA, United States)
Woolaway, J.
(Amber Engineering Co. Goleta, CA., United States)
Date Acquired
August 15, 2013
Publication Date
August 1, 1991
Publication Information
Publication: Workshop Proceedings: Sensor Systems for Space Astrophysics in the 21st Century, Volume 2
Subject Category
Spacecraft Instrumentation
Accession Number
92N22619
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.
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