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Superlattice barrier varactorsSBV (Single Barrier Varactor) diodes have been proposed as alternatives to Schottky barrier diodes for harmonic multiplier applications. However, these show a higher current than expected. The excess current is due to X valley transport in the barrier. We present experimental results showing that the use of a superlattice barrier and doping spikes in the GaAs depletion regions on either side of the barrier can reduce the excess current and improve the control of the capacitance vs. voltage characteristic. The experimental results consist of data taken from two types of device structures. The first test structure was used to study the performance of AlAs/GaAs superlattice barriers. The wafer was fabricated into 90 micron diameter mesa diodes and the resulting current vs. voltage characteristics were measured. A 10 period superlattice structure with a total thickness of approximately 400 A worked well as an electron barrier. The structure had a current density of about one A/sq cm at one volt at room temperature. The capacitance variation of these structures was small because of the design of the GaAs cladding layers. The second test structure was used to study cladding layer designs. These wafers were InGaAs and InAlAs layers lattice matched to an InP substrate. The layers have n(+) doping spikes near the barrier to increase the zero bias capacitance and control the shape of the capacitance vs. voltage characteristic. These structures have a capacitance ratio of 5:1 and an abrupt change from maximum to minimum capacitance. The measurements were made at 80 K. Based on the information obtained from these two structures, we have designed a structure that combines the low current density barrier with the improved cladding layers. The capacitance and current-voltage characteristics from this structure are presented.
Document ID
19930018549
Acquisition Source
Legacy CDMS
Document Type
Conference Paper
Authors
Raman, C.
(Michigan Univ. Ann Arbor, MI, United States)
Sun, J. P.
(Michigan Univ. Ann Arbor, MI, United States)
Chen, W. L.
(Michigan Univ. Ann Arbor, MI, United States)
Munns, G.
(Michigan Univ. Ann Arbor, MI, United States)
East, J.
(Michigan Univ. Ann Arbor, MI, United States)
Haddad, G.
(Michigan Univ. Ann Arbor, MI, United States)
Date Acquired
September 6, 2013
Publication Date
January 1, 1992
Publication Information
Publication: The Third International Symposium on Space Terahertz Technology: Symposium Proceedings
Subject Category
Electronics And Electrical Engineering
Accession Number
93N27738
Funding Number(s)
CONTRACT_GRANT: DAAL03-87-K-0007
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.
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