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Thermal Control Method for High-Current Wire Bundles by Injecting a Thermally Conductive FillerA procedure was developed to inject thermal filler material (a paste-like substance) inside the power wire bundle coming from solar arrays. This substance fills in voids between wires, which enhances the heat path and reduces wire temperature. This leads to a reduced amount of heat generated. This technique is especially helpful for current and future generation high-power spacecraft (1 kW or more), because the heat generated by the power wires is significant enough to cause unacceptable overheating to critical components that are in close contact with the bundle.
Document ID
20110011945
Acquisition Source
Goddard Space Flight Center
Document Type
Other - NASA Tech Brief
Authors
Rodriguez-Ruiz, Juan
(NASA Goddard Space Flight Center Greenbelt, MD, United States)
Rowles, Russell
(NASA Goddard Space Flight Center Greenbelt, MD, United States)
Greer, Greg
(NASA Goddard Space Flight Center Greenbelt, MD, United States)
Date Acquired
August 25, 2013
Publication Date
April 1, 2011
Publication Information
Publication: NASA Tech Briefs, April 2011
Subject Category
Electronics And Electrical Engineering
Report/Patent Number
GSC-15987-1
Distribution Limits
Public
Copyright
Public Use Permitted.
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