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Sputtering - A vacuum deposition method for coating material.The sputtering method is discussed in terms of the unique features which sputter offers in depositing coatings. These features include versatility, momentum transfer, configuration of target, precise controls, and a relatively slow deposition rate. Sputtered films are evaluated in terms of adherence, coherence, and the internal stresses. The observed strong adherence is attributed to the high kinetic energies of the sputtered material, sputter etched surface, and the submicroscopic particle size. Film thickness can be controlled to a millionth of a centimeter. Very adherent films of sputtered PTFE (teflon) can be deposited in a single operation on any type of material and on any geometrical configuration.
Document ID
19720047205
Acquisition Source
Legacy CDMS
Document Type
Conference Paper
Authors
Spalvins, T.
(NASA Lewis Research Center Cleveland, Ohio, United States)
Date Acquired
August 6, 2013
Publication Date
May 1, 1972
Subject Category
Machine Elements And Processes
Report/Patent Number
ASME PAPER 72-DE-37
Meeting Information
Meeting: American Society of Mechanical Engineers, Design Engineering Conference and Show
Location: Chicago, IL
Start Date: May 8, 1972
End Date: May 11, 1972
Sponsors: American Society of Mechanical Engineers
Accession Number
72A30871
Distribution Limits
Public
Copyright
Other

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