Diffusion bonded columbium panels for the shuttle heat shield.

Work at North American Rockwell in the development of a satisfactory panel diffusion bonding method for Nb shuttle orbiter heat shield panel designs is reviewed. The topics include the diffusion bonding process, panel fabrication and quality control. A practicable Nb alloy diffusion bonding method, using a Ti foil interleaf, is described and is characterized as one providing a production basis at competitive cost.