Use of three-dimensional photoelasticity in fracture mechanics

The philosophy of fracture mechanics is reviewed and utilized to formulate a simplified approach to the determination of the stress-intensity factor photoelastically for three-dimensional problems. The method involves a Taylor Series correction for the maximum in-plane shear stress (TSCM) and does not involve stress separation. The results are illustrated by applying the TSCM to surface flaws in bending fields. Other three-dimensional problems solved by the TSCM are cited.