Eutectic bonding of boron-aluminum structural components. II

Eutectic bonding is a diffusion brazing process developed for fabricating boron-aluminum components from composite monolayer. This process relies on the diffusion of a thin surface film of copper into the aluminum matrix to form a liquid phase when heated above the copper-aluminum eutectic temperature of 1018 F. This type of fabrication offers design flexibility in that skin thickness may be varied, the stiffness geometry and orientation can be varied, and local reinforcement can be added. In addition, this type of boron-aluminum structure offers high efficiency. Also, this method of construction can be cost-comparative with complex titanium shapes; simple tooling permits easy layup, bonding is a one-step operation, and little finish machining is required.