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Heat pipe thermal conditioning panelThermal control of electronic hardware and experiments on future space vehicles is critical to proper functioning and long life. Thermal conditioning panels (cold plates) are a baseline control technique in current conceptual studies. Heat generating components mounted on the panels are typically cooled by fluid flowing through integral channels within the panel. However, replacing the pumped fluid coolant loop within the panel with heat pipes offers attractive advantages in weight, reliability, and installation. This report describes the development and fabrication of two large 0.76 x 0.76 m heat pipe thermal conditioning panels to verify performance and establish the design concept.
Document ID
19740056384
Acquisition Source
Legacy CDMS
Document Type
Conference Paper
Authors
Saaski, E. W.
(Donald W. Douglas Laboratories Richland, Wash., United States)
Loose, J. D.
Mccoy, K. E.
(NASA Marshall Space Flight Center Huntsville, Ala., United States)
Date Acquired
August 7, 2013
Publication Date
July 1, 1974
Subject Category
Biotechnology
Report/Patent Number
ASME PAPER 74-ENAS-37
Meeting Information
Meeting: Intersociety Conference on Environmental Systems
Location: Seattle, WA
Country: US
Start Date: July 29, 1974
End Date: August 1, 1974
Sponsors: ASMA, AIAA, SAE, ASME, AIChE
Accession Number
74A39134
Funding Number(s)
CONTRACT_GRANT: NAS8-28639
Distribution Limits
Public
Copyright
Other

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