Capacitor bonding techniques and reliabilityThe effect of thermal cycling on the mechanical failure of bonded ceramic chip capacitors mounted on alumina substrates is studied. It is shown that differential thermal expansion is responsible for the cumulative effects which lead to delayed failure of the capacitors. Harder or higher melting solders are found to be less susceptible to thermal cycling effects, although they are more likely to fail during initial processing operations.
Document ID
19750050818
Acquisition Source
Legacy CDMS
Document Type
Conference Proceedings
Authors
Kinser, D. L.
Graff, S. M. (Vanderbilt University Nashville, Tenn., United States)
Allen, R. V.
Caruso, S. V. (NASA Marshall Space Flight Center Huntsville, Ala., United States)