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Compound solder jointsJoining technique prevents contamination, may be used to join dissimilar metal tubes, minimizes fluid and gas entrapment, expedites repairs, and can yield joints having leakage rates less than 0.000001 standard cubic cm He/min. Components of joint are solder sleeve, two solder rings, Teflon sleeve, and tubing to be joined.
Document ID
19760000274
Acquisition Source
Legacy CDMS
Document Type
Other - NASA Tech Brief
Authors
Batista, R. I.
(TRW, Inc.)
Simonson, R. B.
(TRW, Inc.)
Date Acquired
August 8, 2013
Publication Date
August 1, 1976
Publication Information
Publication: NASA Tech Briefs
Volume: 1
Issue: 2
ISSN: 0145-319X
Subject Category
Fabrication Technology
Report/Patent Number
LAR-11444
Accession Number
76B10274
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.

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