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Bonding aluminum beam leadsReport makes it relatively easy for hybrid-circuit manufacturers to convert integrated circuit chips with aluminum bead leads. Report covers: techniques for handling tiny chips; proper geometries for ultrasonic bonding tips; best combinations of pressure, pulse time, and ultrasonic energy for bonding; and best thickness for metal films to which beam leads are bonded.
Document ID
19770000443
Acquisition Source
Legacy CDMS
Document Type
Other - NASA Tech Brief
Authors
Burkett, F. S. (Electronic Communications, Inc.)
Date Acquired
August 8, 2013
Publication Date
March 1, 1978
Publication Information
Publication: NASA Tech Briefs
Volume: 2
Issue: 4
ISSN: 0145-319X
Subject Category
Fabrication Technology
Report/Patent Number
MFS-23183
Accession Number
77B10443
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.

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