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Microelectronics/electronic packaging potentialThe trend toward smaller and lighter electronic packages was examined. It is suggested that electronic packaging engineers and microelectronic designers closely associate and give full attention to optimization of both disciplines on all product lines. Extensive research and development work underway to explore innovative ideas and make new inroads into the technology base, is expected to satisfy the demands of the 1980's.
Document ID
19780008326
Acquisition Source
Legacy CDMS
Document Type
Conference Paper
Authors
Sandeau, R. F.
(Martin Marietta Corp. Orlando, FL, United States)
Date Acquired
August 9, 2013
Publication Date
November 1, 1977
Publication Information
Publication: NASA. Marshall Space Flight Center Proc. of the 1977 NASA(ISHM Microelectronics Conf.
Subject Category
Electronics And Electrical Engineering
Accession Number
78N16269
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.

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