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A hermetic sealing process for large irregularly shaped hybrid microcircuit enclosuresA system for sealing vacuum baked hybrids in a dry inert atmosphere using an overlapping spot resistance weld is described. A unique electrode configuration and fixturing that permits sealing of large and irregularly shaped gold plated Kovar packages to the hermeticity requirements of MIL-STD-883 was discussed. Metallurgical considerations and comparisons to laser sealing were made. Problems encountered during the development and optimization of the process were highlighted. Solutions to plating, fixturing, warpage, weld splatter and cracked bead problems are presented.
Document ID
19780008331
Acquisition Source
Legacy CDMS
Document Type
Conference Paper
Authors
Stahler, M. R.
(General Electric Co. Philadelphia, PA, United States)
Date Acquired
August 9, 2013
Publication Date
November 1, 1977
Publication Information
Publication: NASA. Marshall Space Flight Center Proc. of the 1977 NASA(ISHM Microelectronics Conf.
Subject Category
Electronics And Electrical Engineering
Accession Number
78N16274
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.

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