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In situ oxidation studies on /001/ copper-nickel alloy thin filmsHigh-resolution transmission electron microscopy studies are reported of (001)-oriented single crystalline thin films of Cu-3%Ni, Cu-4.6%Ni, and Cu-50%Ni alloy which were prepared by vapor deposition onto (001) NaCl substrates and subsequently annealed at around 1100 K and oxidized at 725 K at low oxygen partial pressure. At all alloy concentrations, Cu2O and NiO nucleated and grew independently without the formation of mixed oxides. The shape and growth rates of Cu2O nuclei were similar to rates found earlier. For low-nickel alloy concentrations, the NiO nuclei were larger and the number density of NiO was less than that of Cu-50%Ni films for which the shape and growth rates of NiO were identical to those for pure nickel films. Phenomena involving a reduced induction period, surface precipitation, and through-thickness growth are also described. The results are consistent with previously established oxidation mechanisms for pure copper and pure nickel films.
Document ID
19780034723
Acquisition Source
Legacy CDMS
Document Type
Reprint (Version printed in journal)
External Source(s)
Authors
Heinemann, K.
(NASA Ames Research Center Moffett Field, CA, United States)
Rao, D. B.
(NASA Ames Research Center Materials Science Branch, Moffett Field, Calif., United States)
Douglass, D. L.
(California, University Los Angeles, Calif., United States)
Date Acquired
August 9, 2013
Publication Date
December 1, 1977
Publication Information
Publication: Oxidation of Metals
Volume: 11
Subject Category
Metallic Materials
Accession Number
78A18632
Funding Number(s)
CONTRACT_GRANT: NCA2-0P390-403
CONTRACT_GRANT: NSG-2025
Distribution Limits
Public
Copyright
Other

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