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Energy distributions of sputtered copper neutrals and ionsDirect quantitative analysis of surfaces by secondary ion mass spectrometry will depend on an understanding of the yield ratio of ions to neutrals. This ratio as a function of the energy of the sputtered particles has been obtained for a clean polycrystalline copper surface sputtered by 1000-3000 eV Ar(+). The energy distributions of both neutral and ionized copper were measured with a retarding potential analyzer using potential modulation differentiation and signal averaging. The maximum for both distributions is identical and occurs near 2.5 eV. The energy distributions of neutrals is more sharply peaked than that of the ions, presumably as a consequence of more efficient nutralization of slow escaping ions by the mobile electrons of copper. The ion-neutral ratio is compared with results from various ionization models.
Document ID
19780052134
Acquisition Source
Legacy CDMS
Document Type
Reprint (Version printed in journal)
Authors
Lundquist, T. R.
(Maryland, University College Park, Md., United States)
Date Acquired
August 9, 2013
Publication Date
April 1, 1978
Subject Category
Metallic Materials
Accession Number
78A36043
Funding Number(s)
CONTRACT_GRANT: NGR-21-002-096
Distribution Limits
Public
Copyright
Other

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