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Quality control during IC processingManual gives detailed test procedures for controlling silicon-wafer processing in manufacture of integrated circuits. Included among 43 test procedures are: ionic, bacterial, and solids contamination of high-purity water needed for wafer processing; crystallographic reflection, purity, and orientation; substrate dimensions and finish; thickness of deposited epitaxial films; oxide quality; photoresist characteristics; pinholes in insulating layers; metallized adhesion; and quality of ohmic contact.
Document ID
19790000288
Acquisition Source
Legacy CDMS
Document Type
Other - NASA Tech Brief
Date Acquired
August 10, 2013
Publication Date
December 1, 1979
Publication Information
Publication: NASA Tech Briefs
Volume: 4
Issue: 2
ISSN: 0145-319X
Subject Category
Fabrication Technology
Report/Patent Number
MFS-25112
Accession Number
79B10288
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.

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