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Stress-relieved solder jointsMechanical stress on solder joints is reduced by procedure for soldering electronic components to circuit boards. Procedure was developed for radio-frequency (RF) strip-line circuits, for which dimensions must be carefully controlled to minimize parasitic capacitance and inductance. Procedure consists of loosening component from its mounting after each lead is soldered relieving induced stresses before next soldering step.
Document ID
19790000556
Acquisition Source
Legacy CDMS
Document Type
Other - NASA Tech Brief
Authors
Zemenick, C. J.
(Rockwell Intern. Corp.)
Date Acquired
August 10, 2013
Publication Date
June 1, 1980
Publication Information
Publication: NASA Tech Briefs
Volume: 4
Issue: 4
ISSN: 0145-319X
Subject Category
Fabrication Technology
Report/Patent Number
MSC-14981
Accession Number
79B10556
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.

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