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Effect of multiblade slurry saw induced damage on silicon solar cellsA correlation between the optimum etch loss and the depth of damage is established using wafers produced by the Multiblade Slurry (MBS) and the Internal Diameter (ID) saws. The observations are based on the measurement of the performance of solar cells fabricated on these wafers. Sample preparation and test results are described and the following conclusions are made: (1) the amount of silicon removal necessary for optimum solar cell performance coincides with the depth of saw-induced damage; (2) optimization of cell performance is not affected by the method of silicon removal; (3) sawing conditions should be optimized to minimize the extent of saw-induced damage; (4) the MBS saw is found to induce damage to a lesser extent; (5) since the extent of damage in MBS-sawn wafers is in the limit of etch loss required in texture etching, it is possible to achieve optimum improvement in cell performance by merely texture etching the surface of as-sawn wafers.
Document ID
19790056889
Acquisition Source
Legacy CDMS
Document Type
Conference Proceedings
Authors
Daud, T.
(Jet Propulsion Lab., California Inst. of Tech. Pasadena, CA, United States)
Liu, J. K.
(Jet Propulsion Lab., California Inst. of Tech. Pasadena, CA, United States)
Pollock, G. A.
(Jet Propulsion Lab., California Inst. of Tech. Pasadena, CA, United States)
Koliwad, K. M.
(California Institute of Technology, Jet Propulsion Laboratory, Pasadena Calif., United States)
Date Acquired
August 9, 2013
Publication Date
January 1, 1978
Subject Category
Energy Production And Conversion
Meeting Information
Meeting: Photovoltaic Specialists Conference
Location: Washington, DC
Start Date: June 5, 1978
End Date: June 8, 1978
Sponsors: U. S. Departement of Energy
Accession Number
79A40902
Funding Number(s)
CONTRACT_GRANT: NAS7-100
Distribution Limits
Public
Copyright
Other

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