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Simulation of transducer-couplant effects on broadband ultrasonic signalsThe increasing use of broadband, pulse-echo ultrasonics in nondestructive evaluation of flaws and material properties has generated a need for improved understanding of the way signals are modified by coupled and bonded thin-layer interfaces associated with transducers. This understanding is most important when using frequency spectrum analyses for characterizing material properties. In this type of application, signals emanating from material specimens can be strongly influenced by couplant and bond-layers in the acoustic path. Computer synthesized waveforms were used to simulate a range of interface conditions encountered in ultrasonic transducer systems operating in the 20to 80-MHz regime. The adverse effects of thin-layer multiple reflections associated with various acoustic impedance conditions are demonstrated. The information presented is relevant to ultrasonic transducer design, specimen preparation, and couplant selection.
Document ID
19800060063
Acquisition Source
Legacy CDMS
Document Type
Conference Paper
Authors
Vary, A.
(NASA Lewis Research Center Cleveland, Ohio, United States)
Date Acquired
August 10, 2013
Publication Date
March 1, 1980
Subject Category
Instrumentation And Photography
Meeting Information
Meeting: Spring Meeting
Location: Philadelphia, PA
Start Date: March 24, 1980
End Date: March 27, 1980
Sponsors: American Society for Nondestructive Testing
Accession Number
80A44233
Distribution Limits
Public
Copyright
Other

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