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Assembling Multicolor Printing PlatesImproved joining method uses wave-soldering techniques developed for integrated-circuit-board assemblies. Thermosetting plastic is replaced by wave soldering, which applies a thin even coat of solder to mating copper surfaces. This is done after ink holes and channels have been protected by water-soluble, high-temperature solder mask which prevents wetting and clogging.
Document ID
19810000237
Acquisition Source
Legacy CDMS
Document Type
Other - NASA Tech Brief
Authors
Waters, W. J.
Date Acquired
August 11, 2013
Publication Date
November 1, 1982
Publication Information
Publication: NASA Tech Briefs
Volume: 6
Issue: 2
ISSN: 0145-319X
Subject Category
Fabrication Technology
Report/Patent Number
LEW-13598
Accession Number
81B10237
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.

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