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High-Speed Wafer SlicerMultiblade cutter slices silicon ingots into solar-cell wafers quickly and with little waste. Speed and blade pressure ensure high wafer-production rate. Lightweight, balanced construction minimizes blade vibration and reduces sideways motion that would otherwise widen kerf and waste silicon.
Document ID
19810000332
Acquisition Source
Legacy CDMS
Document Type
Other - NASA Tech Brief
Authors
Schmid, F. (Crystal Systems, Inc.)
Khattak, C. P. (Crystal Systems, Inc.)
Smith, M. B. (Crystal Systems, Inc.)
Date Acquired
August 11, 2013
Publication Date
December 1, 1982
Publication Information
Publication: NASA Tech Briefs
Volume: 6
Issue: 3
ISSN: 0145-319X
Subject Category
Machinery
Report/Patent Number
NPO-15463
Accession Number
81B10332
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.

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