Status of high-temperature laminating resins and adhesivesHigh-temperature polymers now being developed as adhesives and composite matrices are reviewed, including aromatic polyimides, polybenzimidazoles, polyphenylquinoxalines, nadic end-capped imide oligomers, maleimide end-capped oligomers, and acetylene-terminated imide oligomers. The mechanical properties of laminates based on these resins are reported together with preliminary test results on the adhesive properties for titanium-to-titanium and composite-to-composite lap shear specimens.
Document ID
19810036448
Acquisition Source
Legacy CDMS
Document Type
Conference Proceedings
Authors
Hergenrother, P. M. (NASA Langley Research Center Hampton, VA, United States)
Johnston, N. J. (NASA Langley Research Center Hampton, Va., United States)