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Status of high-temperature laminating resins and adhesivesHigh-temperature polymers now being developed as adhesives and composite matrices are reviewed, including aromatic polyimides, polybenzimidazoles, polyphenylquinoxalines, nadic end-capped imide oligomers, maleimide end-capped oligomers, and acetylene-terminated imide oligomers. The mechanical properties of laminates based on these resins are reported together with preliminary test results on the adhesive properties for titanium-to-titanium and composite-to-composite lap shear specimens.
Document ID
19810036448
Acquisition Source
Legacy CDMS
Document Type
Conference Proceedings
Authors
Hergenrother, P. M.
(NASA Langley Research Center Hampton, VA, United States)
Johnston, N. J.
(NASA Langley Research Center Hampton, Va., United States)
Date Acquired
August 11, 2013
Publication Date
January 1, 1980
Subject Category
Nonmetallic Materials
Meeting Information
Meeting: Symposium on Resins for aerospace
Location: Honolulu, HI
Start Date: April 3, 1979
End Date: April 6, 1979
Accession Number
81A20852
Distribution Limits
Public
Copyright
Other

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