Effect of production processes on the fracture strength of silicon solar cellsFracture of Czochralski silicon wafers during processing is an important factor in solar cell yield and cost. A fracture-mechanics test and analysis program was developed to evaluate fracture strength changes in the in-process wafer-to-cell processing at different stages on a manufacturer's production line. The strength data were described by Weibull statistical analysis and can be interpreted with the surface-flaw distribution of each of the process steps.
Document ID
19810042815
Acquisition Source
Legacy CDMS
Document Type
Conference Proceedings
Authors
Chen, C. P. (Jet Propulsion Lab., California Inst. of Tech. Pasadena, CA, United States)
Royal, E. L. (California Institute of Technology, Jet Propulsion Laboratory, Pasadena Calif., United States)
Klink, H. (Motorola, Inc. Semiconductor Div., Phoenix, Ariz., United States)