Development of glass encapsulation techniques for terrestrial photovoltaic arraysTwo parallel development programs for terrestrial solar cell module encapsulation and fabrication are reviewed, including the status of electrostatic bonding as an encapsulation technique. Current designs of electrostatically bonded modules are discussed, fabrication of which is now routine. The design of a high-efficiency module is presented, for which performance reliability features are discussed. This design is compatible with later generation changes such as the introduction of encapsulation by electrostatic bonding. Application of wire mesh contacts by electrostatic bonding has resulted in I-V curve fill factors of 0.74. Cell designs that would allow existing Pyrex glass to be used in electrostatically bonded modules are presented.
Document ID
19810042823
Acquisition Source
Legacy CDMS
Document Type
Conference Proceedings
Authors
Younger, P. R. (Spire Corp. Bedford, MA, United States)
Tobin, R. G. (Spire Corp. Bedford, MA, United States)
Landis, G. A. (Spire Corp. Bedford, MA, United States)
Kreisman, W. S. (Spire Corp. Bedford, MA, United States)
Nowlan, M. J. (Spire Corp. Bedford, Mass., United States)