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A multi-purpose thermoplastic polyimideA linear thermoplastic polyimide, LARC-TPI, has been characterized and developed for a variety of high-temperature applications. In its fully imidized form, this new material can be used as an adhesive for bonding metals such as titanium, aluminum, copper, brass, and stainless steel. LARC-TPI is being evaluated as a thermoplastic for bonding large pieces of polyimide film to produce flexible, 100% void-free laminates for flexible circuit applications. The further development of LARC-TPI as a potential molding powder, composite matrix resin, high-temperature film and fiber will also be discussed.
Document ID
19810059934
Acquisition Source
Legacy CDMS
Document Type
Conference Proceedings
Authors
Saint Clair, A. K. (NASA Langley Research Center Hampton, VA, United States)
Saint Clair, T. L. (NASA Langley Research Center Hampton, VA, United States)
Date Acquired
August 11, 2013
Publication Date
January 1, 1981
Subject Category
Nonmetallic Materials
Meeting Information
Meeting: National Symposium and Exhibition Material and process applications - Land, sea, air, space
Location: Los Angeles, CA
Start Date: April 28, 1981
End Date: April 30, 1981
Accession Number
81A44338
Distribution Limits
Public
Copyright
Other

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