Ion plating for the futureThe ion plating techniques are classified relative to the instrumental set up, evaporation media and mode of transport. Distinction is drawn between the low vacuum (plasma) and high vacuum (ion beam) techniques. Ion plating technology is discussed at the fundamental and industrial level. At the fundamental level, the capabilities and limitations of the plasma (evaporant flux) and film characteristics are evaluated. On the industrial level, the performance and potential uses of ion plated films are discussed.
Document ID
19810060250
Acquisition Source
Legacy CDMS
Document Type
Conference Paper
Authors
Spalvins, T. (NASA Lewis Research Center Cleveland, OH, United States)