NASA Logo

NTRS

NTRS - NASA Technical Reports Server

Collections About News Help Login
Back to Results
Comparison of various silicon sawing methodsThe technology and economics of four methods of wafering silicon boules of large cross section are described. Slurry sawing using either blades or wires, and fixed abrasive sawing using the ID saw or by the FAST method, having the abrasive attached to wires which are arranged in a blade pack, are considered. The technical performance of each method is evaluated and cost/price estimates are summarized.
Document ID
19820015776
Acquisition Source
Legacy CDMS
Document Type
Conference Paper
Authors
Wolf, M. (Pennsylvania Univ. Philadelphia, PA, United States)
Date Acquired
August 10, 2013
Publication Date
February 1, 1982
Publication Information
Publication: JPL Proc. of the Low-Cost Solar Array Wafering Workshop
Subject Category
Energy Production And Conversion
Accession Number
82N23652
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.

Related Records

IDRelationTitle19820015774Collected WorksProceedings of the Low-Cost Solar Array Wafering Workshop
No Preview Available