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Effect of lubricant environment on saw damage in silicon wafersThe chemomechanical effect of lubricant environments on the inner diameter (ID) sawing induced surface damage in Si wafers was tested for four different lubricants: water, dielectric oil, and two commercial cutting solutions. The effects of applying different potential on Si crystals during the sawing were also tested. It is indicated that the number and depth of surface damage are sensitive to the chemical nature of the saw lubricant. It is determined that the lubricants that are good catalysts for breaking Si bonds can dampen the out of plane blade vibration more effectively and produce less surface damage. Correlations between the applied potential and the depth of damage in the dielectric oil and one of the commercial cutting solutions and possible mechanisms involved are discussed.
Document ID
19820015782
Acquisition Source
Legacy CDMS
Document Type
Conference Paper
Authors
Kuan, T. S.
(IBM Watson Research Center Yorktown Heights, NY, United States)
Shih, K. K.
(IBM Watson Research Center Yorktown Heights, NY, United States)
Vanvechten, J. A.
(IBM Watson Research Center Yorktown Heights, NY, United States)
Westdorp, W. A.
(IBM Hopewell Junction, N.Y., United States)
Date Acquired
August 10, 2013
Publication Date
February 1, 1982
Publication Information
Publication: JPL Proc. of the Low-Cost Solar Array Wafering Workshop
Subject Category
Energy Production And Conversion
Accession Number
82N23658
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.
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