NASA Logo

NTRS

NTRS - NASA Technical Reports Server

Back to Results
Wire blade development for Fixed Abrasive Slicing Technique (FAST) slicingA low cost, effective slicing method is essential to make ingot technology viable for photovoltaics in terrestrial applications. The fixed abrasive slicing technique (FAST) combines the advantages of the three commercially developed techniques. In its development stage FAST demonstrated cutting effectiveness of 10 cm and 15 cm diameter workpieces. Wire blade development is still the critical element for commercialization of FAST technology. Both impregnated and electroplated wire blades have been developed; techniques have been developed to fix diamonds only in the cutting edge of the wire. Electroplated wires show the most near term promise and this approach is emphasized. With plated wires it has been possible to control the size and shape of the electroplating, it is expected that this feature reduces kerf and prolongs the life of the wirepack.
Document ID
19820015785
Acquisition Source
Legacy CDMS
Document Type
Conference Paper
Authors
Khattak, C. P.
(Crystal Systems, Inc. Salem, MA, United States)
Schmid, F.
(Crystal Systems, Inc. Salem, MA, United States)
Smith, M. B.
(Crystal Systems, Inc. Salem, MA, United States)
Date Acquired
August 10, 2013
Publication Date
February 1, 1982
Publication Information
Publication: JPL Proc. of the Low-Cost Solar Array Wafering Workshop
Subject Category
Energy Production And Conversion
Accession Number
82N23661
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.
No Preview Available