Design and use of multiple blade slurry sawing in a production atmosphere

The technique and uses of the multiple blade slurry (MBS) saw are considered. Multiple bands of steel are arranged in a frame and the frame is reciprocated with the steel bands to a workpiece, while simultaneously applying abrasive at the point of contact. The blades wear slots in the workpiece and progress through the piece resulting in several parts of wafers. The transition to MBA from diamond slicing is justified by savings resulting from minimized kerf losses, minimized subsurface damage, and improved surface quality off the saw. This allows wafering much closer to finished thickness specifications. The current state of the art MBS technology must be significantly improved if the low cost solar array (LSA) goals are to be attained. It is concluded that although MBS will never be the answer to every wafering requirement, the economical production of wafers to LSA project specifications will be achieved.