ID slicing and the automated factory

The automation of the slicing system utilizing internal-diameter saws for the production of the silicon wafers used in solar arrays is discussed. It is argued that saw productivity can be increased by reducing silicon waste, decreasing usage of consumables, keeping the saw slicing, and increasing the cutting speed. Several machine enhancements utilizing automatic control are discussed. The need for record keeping to anticipate maintenance operations is noted, and a digital serial communication interface with the microprocessor-based saws is recommended. Distributed control of the manufacturing process is discussed in detail, and is recommended as a method for increasing productivity.