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A multi-purpose thermoplastic polyimideA linear thermoplastic polyimide, LARC-TPI, has been characterized and developed for a variety of high-temperature applications. In its fully imidized form, this new material can be used as an adhesive for bonding metals such as titanium, aluminum, copper, brass, and stainless steel. LARC-TPI is being evaluated as a thermoplastic for bonding large pieces of polyimide film to produce flexible, 100% void-free laminates for flexible circuit applications. The further development of LARC-TPI as a potential molding powder, composite matrix resin, high-temperature film and fiber is also discussed.
Document ID
19820037826
Acquisition Source
Legacy CDMS
Document Type
Reprint (Version printed in journal)
Authors
Saint Clair, A. K. (NASA Langley Research Center Hampton, VA, United States)
Saint Clair, T. L. (NASA Langley Research Center Hampton, VA, United States)
Date Acquired
August 10, 2013
Publication Date
October 1, 1981
Publication Information
Publication: SAMPE Quarterly
Volume: 13
Subject Category
Nonmetallic Materials
Accession Number
82A21361
Distribution Limits
Public
Copyright
Other

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