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Silicon solar cells with nickel/solder metallizationThe use of nickel plus solder is shown to be feasible for contact metallization for silicon solar cells by offering a relatively inexpensive method of making electrical contact with the cell surfaces. Nickel is plated on silicon solar cells using an electroless chemical deposition method to give contacts with good adhesion, and in some cases where adhesion is poor initially, sintering under relatively mild conditions will dramatically improve the quality of the bond without harming the p-n junction of the cell. The cells can survive terrestrial environment stresses, which is demonstrated by a 1000 hour test at 85 C and 85% relative humidity under constant forward bias of 0.45 volt.
Document ID
19820040638
Acquisition Source
Legacy CDMS
Document Type
Conference Proceedings
Authors
Petersen, R. C.
(Solarex Corp. Rockville, MD, United States)
Muleo, A.
(Solaris S.p.A. Florence, Italy)
Date Acquired
August 10, 2013
Publication Date
January 1, 1981
Subject Category
Energy Production And Conversion
Meeting Information
Meeting: In: Photovoltaic Solar Energy Conference
Location: Cannes
Country: France
Start Date: October 27, 1980
End Date: October 31, 1980
Accession Number
82A24173
Funding Number(s)
CONTRACT_GRANT: JPL-954854
Distribution Limits
Public
Copyright
Other

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