Economics of ingot slicing with an internal diameter saw for low-cost solar cellsSlicing of silicon ingots using diamond impregnated internal diameter blade saws has been a standard technology of the semiconductor industry. This paper describes work on improvements to this technology for 10 cm diameter ingot slicing. Ingot rotation, dynamic blade edge control with feedback, mechanized blade dressing and development of thinner blades are the approaches tried. A comparison of the results for wafering with and without ingot rotation is also made. A sensitivity analysis of the major cost elements in wafering is performed for 10 cm diameter ingot and extended to the 15 cm diameter ingot case. Various parameter values such as machine cost, feed rate and consumable materials cost are identified both for single and multiple ingot slicing.
Document ID
19820061544
Acquisition Source
Legacy CDMS
Document Type
Conference Proceedings
Authors
Daud, T. (Jet Propulsion Lab., California Inst. of Tech. Pasadena, CA, United States)
Liu, J. K. (California Institute of Technology, Jet Propulsion Laboratory, Pasadena CA, United States)
Fiegl, G. (Siltec Corp. Menlo Park, CA, United States)