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Standards for Epoxies Used in MicroelectronicsImproved qualification standards and test procedures for epoxy adhesives used in assembly of high-reliability hybrid microcircuits listed in new report. Objective of standards to resolve problems in areas of outgassing, bond shear strength, corrosivity, volume resistivity, ionic impurities, electrical stability, and frequency of qualification testing. pp
Document ID
19830000042
Acquisition Source
Legacy CDMS
Document Type
Other - NASA Tech Brief
Authors
Caruso, S. V. (Rockwell International Corp.)
Licari, J. (Rockwell International Corp.)
Weigand, B. L. (Rockwell International Corp.)
Soykin, C. (Rockwell International Corp.)
Date Acquired
August 11, 2013
Publication Date
August 1, 1983
Publication Information
Publication: NASA Tech Briefs
Volume: 7
ISSN: 0145-319X
Subject Category
Materials
Report/Patent Number
MFS-25810
Accession Number
83B10042
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.

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