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Detecting Defective Solder BondsMethod is noncontact and nondestructive. Technique detects solder bonds in solar array of other large circuit board, using thermal-imaging camera. Board placed between heat lamp and camera. Poor joints indiated by "cold" spots on the infrared image.
Document ID
19830000260
Acquisition Source
Legacy CDMS
Document Type
Other - NASA Tech Brief
Authors
Paulson, R. (Lockheed Missiles & Space Co., Inc.)
Barney, J. (Lockheed Missils & Space Co., Inc.)
Decker, H. J.
Date Acquired
August 11, 2013
Publication Date
April 1, 1984
Publication Information
Publication: NASA Tech Briefs
ISSN: 0145-319X
Subject Category
Electronic Components And Circuits
Report/Patent Number
MFS-25507
Accession Number
83B10260
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.

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