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Ultrasonic Bonding of Solar-Cell LeadsRolling ultrasonic spot-bonding method successfully joins aluminum interconnect fingers to silicon solar cells with copper metalization. Technique combines best features of ultrasonic rotary seam welding and ultrasonic spot bonding: allows fast bond cycles and high indexing speeds without use of solder or flux. Achieves reliable bonds at production rates without damage to solar cells. Bonding system of interest for all solar-cell assemblies and other assemblies using flat leads (rather than round wires).
Document ID
19830000702
Acquisition Source
Legacy CDMS
Document Type
Other - NASA Tech Brief
Authors
Frasch, W.
(Kulicke and Soffa Industries, Inc.)
Date Acquired
August 11, 2013
Publication Date
December 1, 1984
Publication Information
Publication: NASA Tech Briefs
Volume: 8
Issue: 2
ISSN: 0145-319X
Subject Category
Fabrication Technology
Report/Patent Number
NPO-16140
Accession Number
83B10702
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.

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