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Polymer research at NASA Langley Research CenterPolymer synthesis programs involve the development of Novel thermoplastics, pseudothermoplastics, and thermosets. These systems are prepared to elucidate structure-property relationships involving thermal capabilities, toughness, processability and environmental stability. Easily processable polyimides, solvent-resistant polysulfones and polyphenylquinoxalines, and tougher high and intermediate temperature polymers were developed. Characterization efforts included high pressure liquid chromatography methodology, the development of toughness tests for fiber reinforced composites, a study of electrical properties of metal ion filled polyimides, and a study of the mutagenicity of aromatic diamines. Also the mechanism of cure/degradation of experimental polymers was studied by rheology, mechanical behavior, separation techniques and spectroscopy. The degradative crosslinking of alkyl-containing polyimides, the separation and identification of crosslinked phenylquinoxalines, the rheological behavior of hot-melt polyimides, and the elucidation of the cure of norbornene endcapped imides were also studied.
Document ID
19830003879
Acquisition Source
Langley Research Center
Document Type
Conference Paper
Authors
Terry L. St. Clair
(Langley Research Center Hampton, Virginia, United States)
Norman J. Johnston
(Langley Research Center Hampton, Virginia, United States)
Date Acquired
August 11, 2013
Publication Date
November 16, 1982
Publication Information
Publication: Advanced Materials Technology
Publisher: National Aeronautics and Space Administration
Volume: NASA/CP-2251
Issue Publication Date: November 1, 1982
Subject Category
Nonmetallic Materials
Meeting Information
Meeting: Advanced Materials Technology Seminar
Location: Hampton, VA
Country: US
Start Date: November 16, 1982
End Date: November 17, 1982
Sponsors: Langley Research Center, American Institute of Aeronautics and Astronautics
Accession Number
83N12149
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.
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