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Liquid encapsulated Czochralski growth of low dislocation GaAsThe availability of high-quality, large-diameter GaAs substrates is key to the successful development and production of high-speed GaAs devices and high-efficiency GaAs solar cells. The liquid encapsulated Czochralski (LEC) technique has provided a means for producing large-diameter GaAs. Progress in improving the LEC growth process which has resulted in 3-inch GaAs crystals with exceptionally low dislocation densities and reduced propensity for twinning is reported. Undoped, semi-insulating GaAs ingots were grown in a Melbourn high-pressure LEC system. The effects of seed perfection, seed necking, cone angle, melt stoichiometry, ambient pressure, thickness of the B2O3 encapsulating layer, and diameter control on the dislocation density were investigated. The material was characterized by preferential etching and X-ray topography. It is shown that 3-inch diameter substrates can be produced with dislocation densities as low as 6000 per sq cm through proper selection and control of growth parameters. Also, the incidence of twinning can be reduced significantly by growing from slightly As-rich melts.
Document ID
19830032566
Acquisition Source
Legacy CDMS
Document Type
Conference Proceedings
Authors
Kirkpatrick, C. G.
(Rockwell International Corp. Thousand Oaks, CA, United States)
Chen, R. T.
(Rockwell International Corp. Thousand Oaks, CA, United States)
Holmes, D. E.
(Rockwell International Microelectronics Research and Development Center Thousand Oaks, CA, United States)
Date Acquired
August 11, 2013
Publication Date
January 1, 1982
Subject Category
Solid-State Physics
Meeting Information
Meeting: Integrated optics and millimeter and microwave integrated circuits
Location: Huntsville, AL
Start Date: November 16, 1981
End Date: November 19, 1981
Accession Number
83A13784
Funding Number(s)
CONTRACT_GRANT: NAS3-22224
Distribution Limits
Public
Copyright
Other

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