NASA Logo

NTRS

NTRS - NASA Technical Reports Server

Back to Results
Solder Bonding for Power TransistorsIndium solder boosts power rating and facilitates circuit changes. Efficient heat conduction from power transistor to heat sink provided by layer of indium solder. Low melting point of indium solder (141 degrees C) allows power transistor to be removed, if circuit must be reworked, without disturbing other components mounted with ordinary solder that melts at 181 degrees C. Solder allows devices operated at higher power levels than does conventional attachment by screws.
Document ID
19840000387
Acquisition Source
Legacy CDMS
Document Type
Other - NASA Tech Brief
Authors
Snytsheuvel, H. A.
(TRW, Inc.)
Mandel, H.
(TRW, Inc.)
Date Acquired
August 12, 2013
Publication Date
April 1, 1985
Publication Information
Publication: NASA Tech Briefs
Volume: 8
Issue: 4
ISSN: 0145-319X
Subject Category
Fabrication Technology
Report/Patent Number
MSC-20570
Accession Number
84B10387
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.

Available Downloads

There are no available downloads for this record.
No Preview Available