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Edge Labels for Multilayer Circuit BoardsQuick visual inspection identifies out-of-place layers. Small copper pads or other labels on layers present regular pattern if multilayer circuit board properly assembled and irregular pattern if one or more layers in wrong place. New method faster, cheaper, and more reliable than earlier methods.
Document ID
19840000388
Acquisition Source
Legacy CDMS
Document Type
Other - NASA Tech Brief
Authors
Rossi, P. J. (Rockwell International Corp.)
Date Acquired
August 12, 2013
Publication Date
April 1, 1985
Publication Information
Publication: NASA Tech Briefs
Volume: 8
Issue: 4
ISSN: 0145-319X
Subject Category
Fabrication Technology
Report/Patent Number
MSC-20704
Accession Number
84B10388
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.

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