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Buffer strips in composites at elevated temperatureThe composite material 'buffer strip' concept is presently investigated at elevated temperatures for the case of graphite/polyimide buffer strip panels using a (45/0/45/90)2S layup, where the buffer strip material was 0-deg S-glass/polyimide. Each panel was loaded in tension until it failed, and radiographs and crack opening displacements were recorded during the tests to determine fracture onset, fracture arrest, and the extent of damage in the buffer strip after crack arrest. At 177 + or - 3 C, the buffer strips increased the panel strength by at least 40 percent in comparison with panels without buffer strips. Compared to similar panels tested at room temperature, those tested at elevated temperature had lower residual strengths, but higher failure strains.
Document ID
19840042220
Acquisition Source
Legacy CDMS
Document Type
Reprint (Version printed in journal)
Authors
Bigelow, C. A.
(NASA Langley Research Center Hampton, VA, United States)
Date Acquired
August 12, 2013
Publication Date
November 1, 1983
Publication Information
Publication: Journal of Composite Materials
Volume: 17
ISSN: 0021-9983
Subject Category
Composite Materials
Accession Number
84A25007
Distribution Limits
Public
Copyright
Other

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